1. 2. 3. material content data sheet sales product name ipb160n04s3-h2 issued 29. august 2013 ma# MA000363377 package pg-to263-7-3 weight* 1526.35 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 8.313 0.54 0.54 5447 5447 leadframe non noble metal iron 7439-89-6 0.909 0.06 596 inorganic material phosphorus 7723-14-0 0.273 0.02 179 non noble metal copper 7440-50-8 907.924 59.48 59.56 594832 595607 wire non noble metal aluminium 7429-90-5 11.132 0.73 0.73 7293 7293 encapsulation organic material carbon black 1333-86-4 8.692 0.57 5695 plastics epoxy resin - 95.613 6.26 62641 inorganic material silicondioxide 60676-86-0 475.166 31.13 37.96 311308 379644 leadfinish non noble metal tin 7440-31-5 12.317 0.81 0.81 8069 8069 plating non noble metal nickel 7440-02-0 0.269 0.02 176 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 0 176 solder noble metal silver 7440-22-4 0.144 0.01 94 non noble metal tin 7440-31-5 0.115 0.01 75 non noble metal lead 7439-92-1 5.487 0.36 0.38 3595 3764 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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